Electronic Technician C Jobs

Group 72 – Fabrication Engineering

MIT Lincoln Laboratory pushes the boundaries of science and engineering to design, model, and fabricate technologies and prototype systems for national security applications. These mission areas include space imaging and data processing, high energy lasers, long range laser communications, ground-based radars, and undersea communication terminals. Within MIT Lincoln Laboratory, the Fabrication Engineering Group works with program teams from initial design through manufacturing, assembly, integration, and testing to fabricate low-volume advanced hardware. Our core PCB capabilities include automated solder paste printing, precision pick and place machines, and automated optical inspection systems. Our core mechanical competencies span precision fabrication, diamond turning, EDM machining, additive manufacturing, and 5-axis machining. Our core assembly, integration, and test capabilities include program integration spaces, cleanrooms, vibration testing, and space simulation chambers. The Group concentrates on high-complexity parts and state-of-practice prototyping capabilities, technical excellence, and quality systems for national security applications. State-of-practice prototyping capabilities are achieved through programs for employee’s technical and personal growth, continuous investigation and implementation of innovative fabrication technologies, and exceptional collaboration.

The position provides the candidate continuous opportunities to learn new skills to match the needs of the protype system, the interests of the candidate, and the Group’s objective to continuously implement innovative fabrication technologies.

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The Group seeks to hire a talented, creative, and motivated individual. The technician has a critical role in the fabrication process and ultimate delivery of the prototype systems through assembly of the electrical subcomponents. The technician contributes to the fabrication of many of the prototype systems with specific job functions as:

• Build small cable assemblies
• Build small electrical sub-assemblies
• Build wire harnessing of all configurations
• Mechanical/electrical assembly of printed circuit board assemblies

• Solder and de-solder through hole and SMT components

• Light to moderate lifting with a maximum 25 lbs

Requirements

• An excitement for fabricating complex parts that enable program teams to develop prototype systems that demonstrate technology of national importance
• Recognized self-motivator that seeks to continuously learn and challenge themselves
• Computer literacy, proficiency with Microsoft Excel and Word
• A desire to build more complex assemblies
• High school diploma or equivalent
• Must pass required in-house training certifications
• General ability to read schematics, assembly drawings, and mechanical drawings is a plus
• A desire to develop advanced fabrication skills like wire bonding, flip chip technologies, direct die attach, selective soldering, fiber splicing
• Ability to work in a team environment
• Knowledge of electronic color code

For Benefits Information, click http://hrweb.mit.edu/benefits

Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.