Ltd Thin Films And Cmp Area Senior Principal Engineer
By Intel Corporation At Hillsboro, OR, United States
Enabling innovations- To deliver program goals with deep process technology inside from both integrated flow and fundamental module capabilities.
10+ years of experience leading and setting priorities for multiple engineering teams in a large organization.
10+ years of manufacturing process development experience working with advanced semiconductor technology nodes.
Experience in working as a module engineer delivering innovation to enable program goals.
Significant Experience in leading teams working on interactions between process modules and programs.
Significant Experience in collaborating with or working in major semiconductor suppliers, preferably related to thin films and CMP.