Package Design Engineer Jobs

· Strong knowledge of Python or Java is also a bonus

Job title: Graduate Software Engineer- Up to $150,000 + Bonus + Package

Salary: Up to $150,000 + Bonus + Package

· Working on highly scalable, low latency infrastructure

· Strong Computer Science fundamentals

· Demonstrable interest in tech, in the form of personal projects or hackathons is preferred

Experience with semiconductor IC packaging including die attach, flip chip, thermal compression bonding

Experience with advanced microelectronics packaging, MCM, 2.5D, 3D, etc., substrate design and layout

Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements

Strong knowledge of problem analysis and diagnosis technique

Strong communication skill and good teamwork skills in working together to achieve goals.

Collaborate with collaborators to evaluate the process risk and propose solutions by performing thermal and mechanical simulations on semiconductor packaging assemblies.

Employees Who Join SimVentions Will Enjoy Benefits Like

Perform systems engineering for analysis, design, development, and test of DoD systems as part of an integrated government team

Impact: work on projects that directly support the defense of our nation.

Serve: work for a company that supports its surrounding communities.

Employee Owned: work with the best and help build YOUR company.

Dress code: business casual. We like to be comfortable while we work.

· Strong knowledge of Java or Python

· Working on highly scalable, low latency infrastructure

· Strong academics with a strong GPA

· Demonstrable interest in tech, in the form of personal projects or hackathons is preferred

· Strong knowledge of Java or Python

· Working on highly scalable, low latency infrastructure

· Strong academics with a strong GPA

· Demonstrable interest in tech, in the form of personal projects or hackathons is preferred

Strong knowledge of Java or Python

Utilising OOP languages, not just limited to Python and Java, to pioneer concepts and work towards goals on greenfield projects

Computer Science degree from a top university

Demonstrable interest in technology as a whole

An elite FinTech are searching for Software Engineers to join a group of the highest-regarded talent around!

Strong knowledge of Java or Python

Utilising OOP languages, not just limited to Python and Java, to pioneer concepts and work towards goals on greenfield projects

Computer Science degree from a top university

Demonstrable interest in technology as a whole

An elite FinTech are searching for Software Engineers to join a group of the highest-regarded talent around!

Fantastic understanding of modern infrastructure - OS, Config Management, Automation etc.

Strong knowledge of cloud infrastructure - ideally AWS including its intricacies

Financial Services experience (ideally in the trading space) is a huge plus

Working on highly scalable, low latency infrastructure; optimised to a level they thought impossible.

Dealing with massive clusters of nodes

Strong programming/scripting - Python ideally

Knowledge of React for frontend development

Utilising OOP languages, not just limited to Java, to pioneer concepts and work towards goals on greenfield projects.

Computer Science degree from a top university

Demonstrable interest in technology as a whole

An elite FinTech are searching for Software Engineers to join a group of the highest-regarded talent around!

Manage IC packaging activity from concept through development, qualification through high volume production

Ensure designed packages meet CPI, SI/PI, and thermal requirements of silicon products

Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp

Support NPI bring-up, package qualification, and sustain support in production + multi-source activities for capacity, cost, & manufacturing flexibility needs

Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on packaging issues

Create package design documentation and assembly instructions

Candidates must be detail-oriented, highly organized, and able to manage multiple tasks.

(Other locations may be available based on demand)

Fall 2023 – June – December

Spring 2024 – January – June

Fall 2024 – June – December

Design and develop packaging for metallic, non-metallic, and biologic products.

Performs other duties as assigned by management.

Ability to follow instructions and respond to management direction.

Knowledge of and adherence to all PCI, cGMP, and GCP policies, procedures, and rules.

Ability to focus No Special Vision Requirements

Bachelors degree in engineering and/or related discipline with 0-2 years experience

Knowledge of packaging development process within life sciences industry – preferably pharmaceutical and biotech

Ensuring that data is managed, stored and evaluated efficiently.

Highly efficient in Python, with minimum 2+ years' professional experience

Experience working within a financial institution, or on financial data is hugely beneficial.

Minimum Bachelors Level Education in Computer Science, Mathematics or related field.

Location: New York (Hybrid/Remote Options)

Partnering with Researchers to explore data sets for brand-new systematic strategies

Experience in project management and communicating technical and project/program status and issue resolution at all levels of the engineering organization

Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability

10+ years of experience in Semiconductor Packaging Design, with at least 6 years of hands-on experience in Advanced Package design

Extensive experience working with advanced packaging tools such as Cadence APD

Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files

Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D package form factors including InFO, CoWoS, FoCoS and EMIB