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Microfabrication Process Engineer Jobs
Company | MIT Lincoln Laboratory |
Address | , Lexington, Ma |
Employment type | |
Salary | |
Expires | 2023-07-22 |
Posted at | 11 months ago |
MIT Lincoln Laboratory’s Microelectronics Laboratory is a 200mm wafer facility with commercial-class equipment serving national security defense and U.S. economic interests. The facility processes full-flows for a range of integrated circuit technologies including 90 nm fully depleted silicon-on-insulator CMOS, science grade CCD imagers, superconductor digital and quantum, photonics, MEMs, and microfluidics.
Position Description
The Microelectronics Laboratory is seeking a process engineer eager to apply their science or engineering skills in support of state-of-the-art superconducting circuits, quantum computing, radiation hardened electronics, charge coupled imagers and more.
As part of a Process Engineering team, the successful candidate will be responsible for developing, monitoring, maintaining, and improving base processes and tool capabilities. Focus areas could include photolithography, reactive ion etch, plasma enhanced chemical vapor deposition, physical vapor deposition, wafer bonding, wet chemical processing and ion implantation. For the successful candidate's assigned area, the person will:
- Be key focal point (process and equipment) for operations, maintenance, and design teams; coordinate and communicate with all affected areas,
- Maintain and improve process capability, lot quality, and operations efficiency,
- Define and implement statistical process control; Respond to process shifts, excursions, misprocess events, and tool downs,
- Coordinate with process integration owners and develop new unit process steps as needed,
- Create and maintain required process procedures and documentation,
- Work with maintenance to maintain and improve equipment performance and capability.
Requirements
- Must be able to work and interact effectively with a wide spectrum of people, including technicians, unit process engineers, technical staff, and specialists
- BS degree, in Electrical Engineering, Material Science, Chemical Engineering, Physics or related field with at least 5 years of experience in micro- or nanofabrication
- Enthusiasm for solving problems and a willingness to work in a cleanroom
- Must have good written and verbal communication skills
- Knowledge and experience in one or more of the following process areas is preferred: plasma enhanced chemical vapor deposition (PECVD), thin film metal deposition, chemical mechanical polish (CMP), ion implantation, reactive ion etch, wet processing, low pressure chemical vapor deposition (LPCVD), thermal oxidation, lithography, silicon wafer thinning, or wafer bonding
- We value skills in process integration for micro- or nanofabrication, metrology equipment use, statistical process control, and design of experiments
Preferred Qualifications:
- 2+ years of experience in microfabrication or other manufacturing environment
- Working knowledge of microfabrication techniques, statistical process control, design of experiments, quality management systems
For Benefits Information, click http://hrweb.mit.edu/benefits
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
To safeguard our health and well-being, MIT Lincoln Laboratory requires COVID-19 vaccination for all employees. Individuals may request exemption from the vaccine requirement for medical or religious reason.
MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
Requisition ID: 39972
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