Packaging Engineer Jobs
By Tesla At , Sparks, 89434, Nv
Manage project budgets, risks, and change management
Assist in vendor selection and vendor management
Proficient at-risk management and communication
Interface with Design Engineering, Manufacturing Engineering, New Product Introduction, and Operations partners to gather and develop packaging requirements
Bachelor’s Degree in Manufacturing, Engineering, Packaging, Industrial Design, or equivalent work experience with evidence of exceptional ability
Working knowledge of CAD, and technical drawings, including datum structure, GD&T and tolerance stack up analysis
Packaging Engineer Jobs
By Pharmaceutical Company At Los Angeles, CA, United States
Collaborate with cross-functional teams to ensure packaging meets product requirements
Ensure packaging designs comply with regulatory requirements and industry standards
Minimum of 5 years of experience in packaging design and development in lieu of a degree
Knowledge of packaging materials, manufacturing processes, and industry standards
Excellent communication and collaboration skills
Ability to work in a fast-paced environment and manage multiple projects simultaneously
Packaging Engineer Jobs
By Stellar Consulting Solutions, LLC At Franklin Lakes, NJ, United States
• Project management experience is preferred
• Knowledge of the following standards: ISO 13485, ISO 11607, and ISO 14971
• Knowledge and understanding of packaging test methods/standards and related test equipment pertaining to Medical Device Packaging
• Lead, coordinate and/or support packaging projects to ensure compliance to specification, timeline, and schedule
• Represent the R&D Packaging Function on multi-functional teams in order to drive Packaging strategy
• Demonstrate strong personal accountability for successful completion of designated tasks
Nand Packaging Engineer Jobs
By Apple At , Cupertino, Ca
Bachelors degree with 10+ years experience in the packaging design and assembly process development for stacked-die memory packages.
Proven knowledge of wirebond and flip-chip assembly process applied to thin-die stacking.
Hands on experience using packaging materials, substrate technology, and their mechanical and thermal behaviors.
Confirmed abilities working in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
Excellent logic, critical thinking skills with strong engineering physics and data driven analysis.
Strong written and verbal communication skills for working with internal multi-functional teams and OSATs.