Packaging Engineer - Photonics

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Company Description

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DeepSight Technology Inc. is a stealth mode startup company that has developed breakthrough technology in ultrasound imaging. This new technology will both extend the range and clarity over current systems by 10x - 100x! We are setting new standards that will dramatically improve the capabilities of ultrasound for many years.

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In order to develop and improve this technology, we need dedicated team players on our side. Not only do we offer a great team-oriented environment, but we also offer a competitive salary of $60,000-$166,000 a year, based on skills, experience, and office location. This position also earns generous benefits in both our St. Louis, MO and Santa Clara, CA offices.

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In this role, as a member of a multi-disciplinary product development team, you will own the packaging development from concept to production for state-of-the-art photonic integrated circuits (PICs). You will be also involved in integrating photonics components with other modules in the system. This position will be looking for someone who can design, develop, and validate a low-cost, high performance and reliable packaging platform for photonics components and system integration.

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Responsibilities Include

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• N Conceive novel concepts for low-cost fiber packaging through optical/mechanical design and modeling of photonic chip coupling interfaces n

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• N Simulate the performance of optical assemblies, with a mind towards the interface between PICs and package, as well as manufacturing tolerances. n

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• N Characterize and qualify the developed packaging solution (optical/mechanical/reliability) with device and systems engineers. n

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• N Work with contract manufacturers to define design rules for manufacturing. n

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• N Document and report to internal members and communicate with external vendors and partners n

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Qualifications

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You Should Have The Following Skills/qualities/experiences

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• N BS or above a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or similar) n

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• N 5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips. n

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• N Experience designing for manufacturability and automated assembly and characterization n

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• N Knowledge of fiber-optical systems and optical polymers n

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Experience With 3D Printing And/or CNC Machining Is Preferred

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• N Ability to read and interpret engineering specifications, drawings, manufacturing instructions, and technical analyses. n

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• N Industry experience creating detailed design documentation (specifications, design descriptions, verification, and testing plans). n

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Other Qualities We Are Looking For

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• N Positive - a can-do attitude that helps you rise to challenges n

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• N Collaborative - a team player who can effectively communicate with others n

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• N Attentive to detail - nothing gets by you n

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• N Efficient - a knack for effectively prioritizing tasks and managing your time n

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• N Pride in your work - real desire to do quality work n

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• N Career-minded - looking for more than a job n

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Benefits And Perks

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We Offer Great Benefits And Perks

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• N Competitive salary n

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• N Stock options n

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• N Medical, dental, and vision insurance n

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• N 401(k) retirement plan n

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Job Posted by ApplicantPro